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Dr Gan is a Professor at the School of Materials Science and Engineering, Nanyang Technological University. He is currently the Director of Temasek Laboratories@NTU and Director of NTU-Lockheed Martin Joint Laboratory, as well as a Fellow of NTU Teaching Excellence Academy. He had previously held the position of Assistant Chair of Alumni (2006-08) and Head of Materials Science Division (2010-12) in MSE, as well as Chairman of NTU Teaching Council (2012-2014). He was also a Visiting Scientist at Massachusetts Institute of Technology (2008-10), a Singapore-MIT Alliance (SMA) Fellow (2006-2010), and a Faculty Associate at the Institute of Microelectronics (2007-2011). Dr Gan was awarded the National Day Award Bronze Medal (Administration) in 2012.
Dr Gan received his B.Eng (Electrical) from the National University of Singapore in 1999, and Ph.D in Advanced Materials for Micro- and Nano-Systems under the Singapore-MIT Alliance Program (SMA) in 2003. His research interests include the reliability study of advanced interconnect systems and advanced packaging technology for harsh environment electronics. His research on using copper nanostructures for low temperature bonding in electronics packaging and other applications has led to the spin-off of a NTU start-up company, Kuprion Inc. in 2016. Other research areas include reliability study of GaN-on-Si devices and developing shape memory ceramics for defense applications. He has received a number of best paper and poster awards at international conferences, as well as being an invited speaker at these conferences. His Hardware Assurance research team in TL@NTU was awarded the Defence Technology Prize (Team R&D) in 2016.
Outside of NTU, Dr Gan is a board member of TL@NUS and TL@SUTD. He also sits in the panel for L’Oréal Women in Science competition. He is a Senior Member of IEEE and past General Chair of International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2010, Technical Chair of IPFA 2008, and past Chairman of IEEE Singapore Reliability/ED/CPMT joint chapter (2014-2015) and IPFA Board member.
Dr Gan received his B.Eng (Electrical) from the National University of Singapore in 1999, and Ph.D in Advanced Materials for Micro- and Nano-Systems under the Singapore-MIT Alliance Program (SMA) in 2003. His research interests include the reliability study of advanced interconnect systems and advanced packaging technology for harsh environment electronics. His research on using copper nanostructures for low temperature bonding in electronics packaging and other applications has led to the spin-off of a NTU start-up company, Kuprion Inc. in 2016. Other research areas include reliability study of GaN-on-Si devices and developing shape memory ceramics for defense applications. He has received a number of best paper and poster awards at international conferences, as well as being an invited speaker at these conferences. His Hardware Assurance research team in TL@NTU was awarded the Defence Technology Prize (Team R&D) in 2016.
Outside of NTU, Dr Gan is a board member of TL@NUS and TL@SUTD. He also sits in the panel for L’Oréal Women in Science competition. He is a Senior Member of IEEE and past General Chair of International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2010, Technical Chair of IPFA 2008, and past Chairman of IEEE Singapore Reliability/ED/CPMT joint chapter (2014-2015) and IPFA Board member.
研究兴趣
论文共 246 篇作者统计合作学者相似作者
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Mechanics of Materialspp.104930, (2024)
MECHANICS OF MATERIALS (2024)
Nature communicationsno. 1 (2023): 7103-10
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)pp.1-6, (2023)
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)pp.1-6, (2023)
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MATERIALS CHARACTERIZATION (2023)
Ceramics Internationalno. 4 (2023): 6984-6995
H.T. Tan, Y. Gao,G.J. Syaranamual, W.A. Sasangka, S.C. Foo, K.H. Lee, S. Arulkumaran, G.I. Ng,C.V. Thompson,C.L. Gan
Microelectronics Reliability (2023): 115165-115165
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