Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing

2023 IEEE International Flexible Electronics Technology Conference (IFETC)(2023)

引用 0|浏览14
暂无评分
摘要
Printed electronics can add value to existing products by providing new smart functionalities, such as sensing elements over large-areas on flexible or non-conformal surfaces. Here we present a hardware concept and prototype for a thinned ASIC integrated with an inkjet-printed temperature sensor alongside in-built additional security and unique identification features. The hybrid system exploits the advantages of inkjet-printable platinum-based sensors, physically unclonable function circuits and a fluorescent particle-based coating as a tamper protection layer.
更多
查看译文
关键词
Hybrid system,thinned ASIC in foil,printed electronics,temperature sensor,system authenticity
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要