Security Enhanced Hybrid Electronic System in Foil for Temperature Sensing
2023 IEEE International Flexible Electronics Technology Conference (IFETC)(2023)
摘要
Printed electronics can add value to existing products by providing new smart functionalities, such as sensing elements over large-areas on flexible or non-conformal surfaces. Here we present a hardware concept and prototype for a thinned ASIC integrated with an inkjet-printed temperature sensor alongside in-built additional security and unique identification features. The hybrid system exploits the advantages of inkjet-printable platinum-based sensors, physically unclonable function circuits and a fluorescent particle-based coating as a tamper protection layer.
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关键词
Hybrid system,thinned ASIC in foil,printed electronics,temperature sensor,system authenticity
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