Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
European Microelectronics Packaging Conference(2013)
摘要
Fracture of Intermetallic Compounds (IMC) under mechanical shock is a major concern for soldered components. While most shock tests are performed under shear load, a specially designed sample setup is designed and fabricated allowing testing under axial pull direction. These samples are fabricated with two pad finish - NiAu and SAC HASL - and comparing solder mask versus non-solder-mask pad defined solder joints. A mini scale of the Charpy equipment setup measures the energy taken up by the solder joints before fracture. The impact of thermal ageing on the shock resistance is also investigated.
更多查看译文
关键词
IMC fracture,HASL and NiAu pad finish,mechanical shock resistance,thermal ageing
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要