Fine-Grained 3-D IC Partitioning Study With a Multicore Processor

Moongon Jung,Taigon Song,Yarui Peng,Sung Kyu Lim

IEEE Transactions on Components, Packaging and Manufacturing Technology（2015）

引用 6|浏览33

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摘要

Low power is widely considered as a key benefit of 3-D integrated circuits (ICs), yet there have been few thorough design studies on how to maximize power benefits in 3-D ICs. In this paper, we present design methodologies to reduce power consumption in 3-D ICs using a large-scale commercial-grade multicore microprocessor (OpenSPARC T2). To further improve power benefits in 3-D ICs on the top of t...

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关键词

Bonding,Through-silicon vias,Multicore processing,Power demand,Timing,Routing

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