Fast window accelerated SDA evaluation for the propagation of multi-layer interconnect
Antennas and Propagation Society International Symposium, 2004. IEEE（2004）
摘要
The spectral domain approach (SDA) is presented here for the solution of complex propagation constant and current distributions of on-chip multi-layer interconnect lines. As SDA is a full wave solution and is usually computing-expensive, a novel wavelet window-based technique is used to accelerate the SDA computation. The proposed algorithm's efficiency and accuracy are discussed and demonstrated.
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关键词
current distribution,integrated circuit interconnections,window accelerated sda evaluation,current distributions,spectral-domain analysis,on-chip interconnect lines,multi-layer interconnect propagation,printed circuits,integrated circuit design,electromagnetic wave propagation,wavelet window-based technique,complex propagation constant,spectral domain approach,acceleration,civil engineering,strips,surface resistance,propagation constant,frequency
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