基本信息
浏览量:94
职业迁徙
个人简介
He has significantly advanced this scientific field through his development of ground-breaking electronics cooling technologies. His engineering practice has not only impacted the academic community, but has also greatly influenced the consumer electronics, telecommunications and energy industries.Due to his pivotal discoveries, many types of electronic systems are able to maintain a higher performance even among the most challenging circumstances. His inventions have also led to improved performance, versatile, reliable, and commercially viable electronic systems for a wide variety of product offerings. He is the author of more than 90 technical papers and more than 100 US patents/ International Patents/ Pending patents. Dr. Refai is an Associate Editor of Journal Components and Packaging, IEEE and Journal of thermal Sciences and Engineering and Applications, Transactions of the ASME. Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2015, the ASME service award and the 2016 IEEC SUNY Binghamton Innovation leader of the year.
研究兴趣
论文共 106 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.303-309, (2023)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-9, (2022)
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.920-925, (2022)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
Gamal Refai-Ahmed,Suresh Ramalingam,Tahir Cader,Jason Strader, Jari Huttunen, Anthony Torza,Srikanth Rangarajan,Bahgat Sammakia, Vadim Gektin, Hussam Kabbani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)pp.530-537, (2021)
Gamal Refai-Ahmed,Huayan Wang,Suresh Ramalingam, Nagadeven Karunakaran,Ke Pan,SB Park, Alegesen Soundarajan,Sreedharan Kelappen Kanaran,C. Key Chung,Yu Lung Huang
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn